• Dutco Tennant LLC, PO Box 233, Dubai, U.A.E.

Sectioning or cutting is the most common technique of revealing the area of interest which is the first step involved in preparation of a specimen for metallographic or microstructural analysis.

Sectioning can be categorized as either abrasive cutting or precision wafer cutting. Abrasive cutting is generally used for metal specimens and is accomplished with silicon carbide or alumina abrasives in either a resin or resin-rubber bond. Proper blade selection is required to minimize burning and heat generation during cutting, which degrades both the specimen surface as well as the abrasive blades cutting efficiency. Wafer cutting is achieved with very thin precision blades. Precision wafering blades most commonly use diamond abrasives, however, cubic boron nitride (CBN) is also used for cutting samples that react to dull diamond (e.g. high carbon, heat treated steels cut more effectively with CBN as compared to diamond). Wafer cutting is especially useful for cutting electronic materials, ceramics and minerals, bone, composites and even some metallic materials. A wide range of cutting accessories lets you perform cutting of a complete range of materials, sizes, and sections.

Choose the right equipment, consumables, and accessories right here.

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Abrasive Cutter – Manual

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Abrasive Cutter- Automatic

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Precision Cutter

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Accessories & Consumables

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